Rigao Electronics
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Turnkey PCB Assembly Services for Prototyping and Volume Production
| Rigid-Flex PCB Capability | |||
| Category | Item | English | Metric |
| Laminates | Max. Number of Layers | 16 L (R+F) | 16 L (R+F) |
| Min. Finished Board Thickness | 0.01" | 0.3 mm | |
| Max. Finished Board Thickness | 0.062" | 1.6 mm | |
| Finished Board Thickness Tolerance | ± 10% | ± 10% | |
| Max. Panel Size | 19.68" * 19.68" | 500 * 500 mm | |
| Copper | Max. Inner Layer Copper Thickness | 2 oz | 0.07 mm |
| Max. Outer Layer Copper Thickness | 3 oz | 0.105 mm | |
| Trace | Min. Inner Layer Line Width | 2 mil | 0.05 mm |
| Min. Inner Layer Line Spacing | 2 mil | 0.05 mm | |
| Min. Outer Layer Line Width | 2 mil | 0.05 mm | |
| Min. Outer Layer Line Spacing | 2 mil | 0.05 mm | |
| Min. BGA Pitch | 13.7 mil | 0.35 mm | |
| Min. BGA Pad | 8 mil | 0.2 mm | |
| Holes | Hole Position Tolerance | ± 3 mil | ± 0.075 mm |
| Hole Size Tolerance(PTH) | ± 3 mil | ± 0.075 mm | |
| Hole Size Tolerance(NPTH) | ± 2 mil | ± 0.05 mm | |
| Min. Plated Slot | 15.7 mil | 0.4 mm | |
| Min. Non-Plated Slot | 15.7 mil | 0.4 mm | |
| Drill | Min. Mechanical Drill Hole Size | 6 mil | 0.15 mm |
| Min. Laser Drill Hole Size | 3 mil | 0.075 mm | |
| Max. Mechanical Drill Hole Size | 256 mil | 6.5 mm | |
| Aspect Ratio | 12:1 | 12:1 | |
| Gold Finger | Angle of Beveling | 15-45° | 15-45° |
| Angle of Beveling Tolerance | ± 3° | ± 3° | |
| Depth of Beveling | ≥ 4 mil | ≥ 0.1 | |
| Depth of BevelingTolerance | ± 3 mil | ± 0.075 mm | |
| Profile | V-Cut Position Tolerance | ± 3 mil | ± 0.075 mm |
| CNC Tolerance | ± 4 mil | ± 0.1 mm | |
| Stamping Tolerance | ± 4 mil | ± 0.1 mm | |
| Special Process | Controlled Impedance Tolerance | ± 3% | ± 3% |
| Min. Pad with Via | 7 mil | 0.175 mm | |
| Blind and Buried Via | 3+N+3 | 3+N+3 | |
| Plugged Via | Resin Filled or Conductive Filled | ||
| Color of Solder Mask | Green | Matte Green | Light Green |
| Black | Matte Black | Red | |
| Yellow | White | Blue | |
| Color of Silk Screen | White | Black | Yellow |
| Green | Red | Blue | |
| Surface Finishing | HASL | HASL Lead Free | Immersion Silver |
| Immersion Gold (ENIG) | Gold Finger (Hard Gold) | Immersion Tin | |
| PCB Material | FR-4 (SHENGYI) | High TG FR-4 (SHENGYI) | PI (Panasonic) |
| PTFE(Rogers) | PTFE(Arlon) | PTFE(Tuc) | |
Turn-key Electronics Manufacturing Services for Printed Circuit Boards and Assembly
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